Why India believes a 3D glass semiconductor project is its most important chip bet
Indian Express·4h ago·Neutral
What Happened
India laid the foundation stone for its first advanced 3D chip packaging unit in Bhubaneswar, Odisha. The Rs 1,934 crore project, led by US-based 3D Glass Solutions under the Rs 76,000 crore India Semiconductor Mission, will produce glass substrates and 3D modules for AI, 5G, defense, and data centers. The facility has received investments from Intel and Lockheed Martin.
Key Entities
India3D Glass SolutionsBhubaneswarOdishaIndia Semiconductor MissionIntelLockheed MartinTata GroupMicron TechnologyS Krishnan